We are a global semiconductor company that develops products for high-voltage power conversion applications. We deliver the highest performance and highest reliability GaN devices and best-in-class applications-driven design support to a growing customer base. We create innovations that move beyond the limitations of silicon to capture 90% of today’s energy losses.

SUMMARY:
This is a Senior/ Principal Level role to develop advanced packages for high performance power semiconductor products with high reliability, low cost and mass production capability by collaborating with related departments and suppliers around the world.

MUST HAVES:

• Hands-on Packaging Design Experience for (High Power) Products!
• Experience Modeling
• Experience with Multichip, Stacked Dies Packages
• Experience in Design, and Manufacturing

DUTIES & RESPONSIBILITIES:

• Analyze stress, thermal capability and electrical performance with in-depth knowledge of thermal-mechanical and electro-chemical interactions.
• Define BOM, assembly specification and qualification per standard requirements.
• Resolve package reliability issues with thorough knowledge in the whole assembly processes.
• Assembly process SPC, yield improvement, cost, throughput and capability analysis.
• Working with management and cross functional teams, help develop a packaging roadmap aligned with the company’s product roadmap and revenue targets.
• Work with device design / product engineering teams and external high volume packaging vendors. Complete reports, and production documentations.

EDUCATION & EXPERIENCE:

• Experience with various package generations, packaging schemes and production tools. Capable of defining clear BOM, assembly parameter optimization and qualification.
• Experience with ACAD software.
• Experience with package related design/simulation software.
• Bachelors in mechanical engineering, material science or similar required.
• 5+ years of experience in semiconductor packaging industry with hands-on design/engineering duties. Experience in semiconductor, microelectronics, direct bonded or plated Cu isolation, power packaging and assembly engineering including high current clip, various wire bonding and module assembly preferred.
• Experience in solder, epoxy processes, low thermal resistance interfaces, thermal fatigue of interfaces and wire bonding intermetallic growth mechanisms.
• Experience in multichip, stacked dies packages and assembly automation.
• Experience in qualification of high voltage/power packages. Qualification in very high humidity and corrosive environment a plus Experience in building a supply chain of vendors and service providers.